Soldering Assembler - 2nd Shift

Nesco Resource - - Responsibilities: Perform high-mix SMT and through-hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards.; Remove, replace, and re-work components, including bottom-terminated devices (QFNs, BGAs, LGAs) using hot-air pencils, hot plates, reflow ovens, and specialty rework stations.; Conduct X-ray inspection of re-worked bottom-terminated parts, evaluate solder joint integrity, and document findings.; Execute board-level verification (visual, AOI, X-ray) and functional testing to ensure conformance to specifications.; Maintain cleanroom and ESD-controlled work areas; monitor and record equipment parameters (temperature, airflow, etc.).